JPS6260038U - - Google Patents

Info

Publication number
JPS6260038U
JPS6260038U JP15212285U JP15212285U JPS6260038U JP S6260038 U JPS6260038 U JP S6260038U JP 15212285 U JP15212285 U JP 15212285U JP 15212285 U JP15212285 U JP 15212285U JP S6260038 U JPS6260038 U JP S6260038U
Authority
JP
Japan
Prior art keywords
pick
chip
arm
chips
arm body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15212285U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15212285U priority Critical patent/JPS6260038U/ja
Publication of JPS6260038U publication Critical patent/JPS6260038U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP15212285U 1985-10-04 1985-10-04 Pending JPS6260038U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15212285U JPS6260038U (en]) 1985-10-04 1985-10-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15212285U JPS6260038U (en]) 1985-10-04 1985-10-04

Publications (1)

Publication Number Publication Date
JPS6260038U true JPS6260038U (en]) 1987-04-14

Family

ID=31069812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15212285U Pending JPS6260038U (en]) 1985-10-04 1985-10-04

Country Status (1)

Country Link
JP (1) JPS6260038U (en])

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435743U (en]) * 1987-08-28 1989-03-03
JPH07193093A (ja) * 1993-12-24 1995-07-28 Nec Corp ダイボンディング装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494876A (en) * 1978-01-12 1979-07-26 Toshiba Corp Multicollet holder
JPS604228A (ja) * 1983-06-23 1985-01-10 Toshiba Corp 半導体ダイボンデイング装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494876A (en) * 1978-01-12 1979-07-26 Toshiba Corp Multicollet holder
JPS604228A (ja) * 1983-06-23 1985-01-10 Toshiba Corp 半導体ダイボンデイング装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6435743U (en]) * 1987-08-28 1989-03-03
JPH07193093A (ja) * 1993-12-24 1995-07-28 Nec Corp ダイボンディング装置

Similar Documents

Publication Publication Date Title
JP2773307B2 (ja) 電子部品の実装方法
EP1174909A2 (en) Apparatus for the placement and bonding of a die on a substrate
JP3311304B2 (ja) ロボットの制御方法
GB2034613A (en) Method and apparatus for mounting electronic components
JPS6318326B2 (en])
JP3301347B2 (ja) 導電性ボールの搭載装置および搭載方法
JPS6260038U (en])
JP2861135B2 (ja) 部品実装方法
JP3152091B2 (ja) 電子部品実装装置
KR890004245Y1 (ko) 반도체 칩 자동본딩 장치
JPS6245146A (ja) 治具およびこの治具を有する整列供給装置
JPH0213934B2 (en])
JPH0212024B2 (en])
JP3900269B2 (ja) 部品実装方法及び部品実装装置
JP2839614B2 (ja) 位置検出装置
JPH0547470Y2 (en])
JPH0354836A (ja) 吸着ヘッド
JPS60122865U (ja) 自動分析装置における容器の交換装置
JP2811869B2 (ja) ボンディングヘッド装置
JPS6260037U (en])
JPH0213933B2 (en])
JPS6210440U (en])
JPH01276700A (ja) 電子部品ボンデイング装置
JPH10313197A (ja) 表面実装用電子部品位置決め装置
JPH0279036U (en])